RHEOLOGY; Materials in Motion The Science of Circuit Board Lamination
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چکیده
Circuit boards have become more intricate and material performance and reliability in the multilayer board manufacturing process is more critical than ever before. Prepregs must readily meet the new demands of today’s electronic product designs. The application of prepreg rheology in the lamination cycle can help characterize and design prepregs to allow enhanced performance under the increased demands of miniaturization, SMT and advanced packaging designs.
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